Bond X
Bond X
- Usually dispatched within 48 hours
- 6+1 FREE or 12+3 FREE
- In stock, ready to ship
- Inventory on the way
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Bond X
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Acid-free bonder which can be used with gel polish, gel and acrylic, it can even be used under traditional nail polish. It penetrates the nail plate cleaning out the ridges of any oils, fats or dirt before filling the ridges with a special kind of gel leaving the surface layer very sticky. It provides maximum adhesion for all products, eliminate lifting to a minimum and will increase the longevity of the wear.
Ingredients: MEK, Urethane Methacrylate, HEMA, Hydroxypropyl Methacrylate, Trimethylbenzoyl Diphenylphosphine Oxide
Bond X
8 ml
Adhesion booster. Bond X is an acid-free bonding
solution. It is Step 2 in nail preparation. Apply after
Freshner (or Starter Liquid). Replaces Ultrabond
Primer.
Bond X particles are smaller than Ultrabond Primer
and can penetrate the nail layers deeper. The nail
surface is left with a sticky residue. Bond X
provides maximum adhesion for all products. For
best results flash cure for 10 seconds. Bond X can
be applied in 2 layers for maximum adhesion.
Bond X may also be used:
- After filing to hide small lines
- In the line where gel meets natural nail (minor lifting)
- Before top gel if the customer has a small amount of visible lifting in the cuticle area.
- Characteristics:
- Unique adhesion booster
- Universal bonding solution for gel, acrylic or nail polish
- Deep penetrating
All shipments within Malta generally arrive at the destination specified by the customer within 1-2 business days of the date of entry into force of the contract of sale. All shipments outside of Malta are guaranteed to arrive within 14 calendar days.